The conference is open to any communication connected with residual stresses and/or internal stresses, of academic or industrial nature, fundamental or applied, experimental or numerical or theoretical, at macro or micro or nano scales, from manufacturing to physical or technical properties.
The following topics are not exhaustive. They do not reflect the actual program which will be constructed from the received abstracts.

 Measurement methods 

  • Diffraction methods (Lab. and synchrotron X-rays, neutrons, EBSD, CBED…)
  • Line profile analysis (for 3rd order stresses/strains)
  • Magnetic methods
  • Ultrasonic and vibration methods
  • Photomechanical methods (DIC, ESPI, moiré, grid, photoelasticity, thermography…)
  • Mechanical methods (hole drilling, contour, layer removal, crack compliance, indentation…)

 Modeling methods 

  • Macroscale modeling with Finite Elements Methods, BEM, meshless…
  • Multiscale modeling (multiphase, polycrystalline structure…)
  • Dislocation dynamics
  • Molecular dynamics

 Residual Stresses management and control 

  • Design, engineering, product life cycle management
  • Stress monitoring in industrial environment
  • Standards, quality control, metrological aspects

 Residual Stresses in manufacturing processes 

  • Heat treatments
  • Mechanical and Thermo-Chemical Surface treatments
  • Casting, additive technologies
  • Machining, cutting
  • Coating technologies (PVD, CVD, electrochemical deposition or thermal projection)
  • Welding and other assembling methods

 Residual Stresses in advanced materials 

  • Polymer based composites
  • Metal and/or ceramics composites
  • Glass and amorphous materials
  • Functionally Graded Materials (FGM)
  • Nanocrystallized / nanostructured materials
  • Thin films, coatings, multilayers

 Residual Stresses, Internal Stresses and microstructure 

  • Phase transformation, phase stresses
  • Intergranular / intragranular stresses
  • Dislocations assemblies

 Residual Stresses in components and structures 

  • Distorsion Engineering
  • Stress relaxation methods
  • MEMS, electronic devices
  • Residual stresses in biological systems
  • Residual stresses in geological materials and structures
  • Residual stresses in archeological and historical artefacts

 Consequences of Residual Stresses 

  • Fatigue, crack propagation, damage
  • Chemical reactivity, stress corrosion
  • Physical properties of solids (magnetic, optical, electrical…)